Steve Anderson, STATS ChipPAC
Mike Campbell, QUALCOMM
Jae Cho, NPI Engineering at Xilinx
Dan Hutcheson, VLSI Research
Devan Iyer, Texas Instruments
Subu Iyer, IBM
Dick James, Chipworks
Bob Lanzone, Sr. Amkor Technology Inc.
Mr. Yoon-Woo Lee, Samsung
Mike Ma, Siliconware Precision Industries
Bill McClean, IC Insights, Inc.
Robert Patti, Tezzaron Semiconductor
Sanjay Rajguru, ISMI
Julian Richards, ISMI
Bill Ross, ISMI
An Steegen, imec
Ted Tessier, FlipChip
Mark Thirsk, Linx Consulting
Click here for more information on speakers of The ConFab.
Technologies and Business Strategies of the Future IT Industry
Presented by Mr. Yoon-Woo Lee, Executive Advisor at Samsung Electronics Co., Ltd.
Technology is advancing rapidly in various sectors, basically driven by semiconductors that have strived toward greater performance, lower power, and smaller form through relentless migration. What is now important is enriching the end user experience with a view on the entire value chain of the ecosystem. This is especially true as the IT revolution is now spilling over into other cutting edge fields like bio, nano, energy, and the environment. Collaboration is also critical in intra-regional trade and development. Countries will need to lower risk and boost efficiency through closer cooperation along the supply chain, forging alliances, devising common standards, and undertaking joint R&D. This session reviews what is currently happening in the IT industry and suggests strategies of collaboration within the industry.
Orthogonal Scaling to Fill Today’s Fabs in the Future
Presented by Subu Iyer, IBM Fellow, Microelectronics Div. of IBM Systems & Technology Group
Semiconductor technology development is at an inflection point where the historical expectations for node-to-node productivity are difficult to maintain. This slowing down of classical scaling is an opportunity to explore alternative ways of leveraging both our technology and existing fab infrastructure. This talk will ask some tough questions on what we can really expect from recent technological innovations such as Hi K gate dielectrics and FInFets in the future, and what some other constraints are. We will explore the addition of orthogonal features to existing technologies that will enhance them significantly. Fabs of the future will be more diverse, offer a variety of novel capabilities, be more intimately tied to their clients whether they are captive or not, and will have to be a bigger part of the overall systems’ supply chain.
The ConFab’s invitation-only executive conference provides a unique atmosphere for top decision makers who represent device manufacturers, OEMs, OSATs, fabless and foundry operations around the world to connect, collaborate and create strategic alliances for the future. In 2013, this unique event is expanding its outstanding conference program and networking opportunities to allow even more manufacturing managers the opportunity to participate.
Under the direction of Event Chair and Solid State Technology Editorial Director Pete Singer, The ConFab’s world-class conference program is presented by the industry’s foremost experts and analysts. The program focuses on the pressing economic and manufacturing issues affecting the semiconductor and related industries to encourage collaboration on solutions. In 2013, we will add more sessions to The ConFab’s conference program to offer a two-day paid track, from June 24 - June 25, 2013, focused on issues that are important to a wider range of manufacturing managers.
In addition, three well-attended networking receptions plus meals and breaks during The ConFab allow participants to meet in a relaxed environment that facilitates lasting connections. And for qualified executives attending the event, The ConFab also offers the opportunity to participate in one-on-one strategic meetings with suppliers to build crucial alliances for the future.
Register today to attend The ConFab, one of the most valuable events you will attend all year.