Advisory Board

2010 Advisory Board

The members of The ConFab Advisory Board are senior executives representing both the semiconductor device manufacturing community and semiconductor equipment suppliers. These industry experts and leaders focus on developing a conference which will provide attendees with practical information and strategic guidance on the new economics of semiconductor manufacturing.

Advisory Board Members:

David Bennett, VP, Strategic Mfg, and Alliances, GLOBAL FOUNDRIES

William R. Rozich, Director, 300mm Fab Operations, Albany Nanotech, IBM

Janice M. Golda, Director, Lithography Capital Equipment Development, Intel

John Chen, Vice President, Nvidia

Sima Salamati, Test Technology & Product Engineering Mgr., Texas Instruments

Kevin Logue, DMOS6 Engineering Manager, Texas Instruments

Hans Stork, CTO, Applied Materials

Lori Nye, VP, Stategic Manufacturing and Alliances, Brewer Science

Dr. Sitaram R. Arkalgud, Director, SEMATECH

Paul Edstrom, CTO, GE Commercial Finance, Global Electronics Solutions

Bill Tobey, President, ACT International

Ken Rygler, President, Rygler & Associates (founder of Toppan Photomasks)

Takeshi Hattori, President, Hattori Consulting International

Jean Lemoin, Founder and President, MCA

Peter Singer, Editor-in-Chief of Solid State Technology, PennWell Corporation

David Bennett
VP Strategic Manufacturing and Alliances
GLOBAL FOUNDRIES

David Bennett is the Vice President of Alliances for GLOBALFOUNDRIES Inc. In this capacity Bennett leads the corporation in establishing key strategic alliances in technology, manufacturing and design enablement. These include such efforts as the IBM joint development alliance, SEMATECH/ISMI, Albany Nanotech, and joint development programs with suppliers. He is currently serving on the Board of Directors for SEMATECH/ISMI.

Prior to GLOBALFOUNDRIES, Bennett was with AMD for 13 years in various executive management roles. In one of his final assignments at AMD, he helped to lead the Asset Smart strategy which ultimately gave rise to the GLOBALFOUNDRIES spin-off. Prior to joining AMD, Bennett worked at SEMATECH as the Technology Transfer Manager as a Texas Instruments (TI) assignee. At TI, he was the Process Control Manager for the Dallas Linear wafer fabs. David started his career in the semiconductor industry with TI in 1984. He obtained both a BS and Masters in Chemical Engineering from the Colorado School of Mines in 1982 and 1984 respectively. David is a 26 year veteran of the semiconductor industry and has published numerous papers, holds several patents and has served on a variety of boards and advisory groups.

Bill Rozich
Director Fab Operations
Albany NanoTech Systems and Technology Group, IBM

Bill joined IBM as a junior engineer in East Fishkill in 1974. After numerous process engineering assignments in photolithography, he accepted an initial management position in Photolithography Equipment Engineering. Subsequent to various production management assignments, including manufacturing superintendent, Bill was appointed in 1987 to a program manager position on the Corporate Manufacturing staff, responsible for worldwide manufacturing strategies and sourcing. He returned to East Fishkill in 1990 as manager of the 64MEG EPL and transferred to Burlington in 1992 as functional manager of Equipment Engineering. In 1995 Bill was appointed Director of Equipment Technology with responsibility for worldwide selection, procurement, and installation of IBM Microelectronics capital equipment and management of the Sematech investment. In February 2004, Bill was appointed Director of 300mm Semiconductor Operations with responsibility for all production activities in the 300mm facility in East Fishkill.

Bill assumed his current position in June of 2005 responsible for the ramp-up and day-to-day operation of this facility. In this capacity Bill is the IBM liaison with the Albany team providing infrastructure support and coordination of fab operations for IBM’s team in this joint effort. Bill served as IBM's representative to the Sematech Executive Steering Committee since 1995, including a term as chair from 1999 thru 2000, and served as IBM’s representative to I300I, the consortium which drove industry standards for the 300mm transition. Bill also was a member of the ALTIS (joint venture between Infinion and IBM) Shareholder's Council from 2001 thru 2003. Bill is currently serving as a member of the Sematech Board of Directors. Bill holds a bachelor's degree from Fordham University and a master's degree from SUNY New Paltz in Chemistry.

Sima Salamati
Test Technology and Prodcut Engineering Manager
Texas Instruments

Sima Salamati is manager of the Test Technology and Product Engineering Group (TT-PEG) in TI’s Technology & Manufacturing organization. Prior to this role, Sima managed TI’s DMOS6 300mm wafer fab. Sima holds a master's degree in Electrical Engineering from Southern Methodist University. She is also a Senior Member of Technical Staff (SMTS), part of TI's Technical Ladder. Along with being a sponsor of TI’s internal Women’s Initiative networking organization, Sima is also an Executive Member of the Manufacturing Technical Council.

Kevin Logue
DMOS6 Engineering Manager
Texas Instruments

Kevin currently leads the engineering organization within Texas Instruments’ 300mm wafer fab, DMOS6. Kevin graduated from the University of Dayton with a Bachelors degree in Chemical Engineering and joined Texas Instruments in 1984. During his 25 year career with the company, he has worked in 4 different wafer fabs and has managed Manufacturing along with Process and Equipment Engineering organizations . His career has involved him in the production of Memory, Logic and Analog devices.

Dr. Sitaram R. Arkalgud
Director
SEMATECH's 3D Interconnect Initiative

While on assignment to SEMATECH from Qimonda/Infineon Technologies, Arkalgud directed SEMATECH’s Interconnect division for three years, during which time he led efforts to screen, characterize, and improve the performance of low-k dielectric materials for the ITRS 45 and 32nm technology generations, and also initiated the exploration of next-generation 3D interconnects. Working directly for SEMATECH in his new role, Arkalgud will lead an expanded 3D program that will drive the industry’s most comprehensive research into the potentials of 3D interconnects using through silicon vias. In exploring the different 3D options, including wafer-to-wafer and die-to-wafer integration, Arkalgud and his researchers will define and map 3D technology options, develop unit processes and metrology, and ultimately demonstrate 3D’s functionality and reliability.
“We are delighted that SEMATECH and our industry partners will continue to benefit from Sitaram’s expertise,” stated Dao. “Support and momentum are building for 3D, and Sitaram’s strong technical background, leadership, and collaborative skills are perfectly suited to building, promoting, and realizing this major SEMATECH 3D initiative.”

Prior to his assignment at SEMATECH, Arkalgud served as Infineon’s director of the MRAM Development Alliance between Infineon and IBM. Earlier, he worked as a Technology Officer for the Memory Products Division and product manager for Ferroelectric RAM development at Infineon. Arkalgud came to Infineon from Motorola Inc., after working for nine years in several advanced logic and memory projects.

The author of more than 26 publications and presentations, and holder of 14 U.S. patents, Arkalgud earned a doctorate and master’s degree in materials engineering from Rensselaer Polytechnic Institute in Troy, NY, and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College, Suratkal, India.

Paul Edstrom
Chief Technology and Commercial Development Officer
GE Commercial Finance - Global Electronics Solutions

Paul Edstrom is responsible for the development and management of GES' lease portfolio, and all product management and strategic OEM alliances. These responsibilities encompass IC manufacturing, ATE, printed circuit board assembly, and FPD equipment segments. A 27-year industry veteran, Edstrom began his career with Intel Corporation in Santa Clara and then moved to Ultratech Stepper. Most recently, Edstrom served as a founding member and senior vice president of Comdisco Electronics Group, where he was responsible for strategic alliances and product management.

Bill Tobey
President
ACT International

Mr. Tobey brings more than 25 years of experience in the industry, having served as Vice President at both GCA Corporation and Micronix Corporation. He is currently President of ACT International, a management consulting firm serving the semiconductor and flat panel display industries, located in Waltham, Massachusetts. Mr. Tobey has served on the board of SEMI and on the U.S. Department of Commerce Technical Advisory Committee for Semiconductors. He is has served on the Board of Chartered Semiconductor Manufacturing Ltd. in Singapore as well as on other boards. Mr. Tobey holds a bachelor of science degree in mechanical engineering from Tufts University and a master of science degree from the University of Connecticut.

Ken Rygler
President
Rygler & Associates

Ken Rygler is the president of Rygler and Associates, Inc., a consulting firm focused on "Bringing Technology To Market." He founded DuPont Photomasks in 1986 and led its IPO in 1996. Prior to starting Rygler and Associates in January, 2002, Mr. Rygler was executive vice president of DuPont Photomasks. Before retiring from DuPont in 1996, Mr. Rygler held numerous senior business management responsibilities in a variety of businesses in the electronics, industrial, and consumer markets.

Jean LeMoin
Founder & President
MCA

Electronics industry veteran, Jean LeMoin, has nearly three decades of experience in strategic marketing and public relations. In 1983, she founded Mountain View, Calif.-based MCA, a full-service strategic relations agency focused on high-growth companies in the semiconductor, flat-panel display and microelectronics industries. Technology and market leaders in these sectors rely on MCA's public relations, investor relations and interdisciplinary communications counsel to successfully drive sales, increase valuation and build global brand.

In her current role, Jean is responsible for the vision and future direction of the agency and its global partner network. She also serves as a senior strategic resource for the agency and is therefore, intimately involved in crafting the strategic positioning, competitive messaging and program strategies for MCA's client roster. Leveraging her in-depth agency, corporate and association experience in the semiconductor industry, Jean and the MCA account teams work hand-in-hand to ensure unique programs are designed and implemented to support both the business and marketing objectives of each client.

Over the years, Jean has remained actively involved in shaping the industry outlook on many important subjects. In addition, she has led many of the new technology launches over the years. Some examples include: the industry's first minienvironments and first in-situ particle monitoring technologies; the first single-wafer etchers and CMP technologies; kicking off the industry's copper revolution with the first electrofill system for copper deposition; and more recently, Soitec's successful efforts to mainstream silicon-on-insulator (SOI) technology. Over the past 20+ years, Jean has also worked closely with KLA-Tencor in their successful communications outreach to make the company and process control synonymous with overcoming next-generation manufacturing challenges and increasing fab ROI. In the EDA sector specifically, she worked closely with Simplex Solutions as they rolled out the X Architecture, and also led the strategic recommendations for Cadence in the company's annual perceptual audits.

John Chen
VP of Technology and Foundry Operations
Nvidia

Dr. Chen has 30 years of experience in IC industry ranging from IDM to Foundry to Fabless companies. He started his career as a researcher in Hughes Research Laboratories, subsequently at Xerox Palo Alto Research Center (PARC). Most of his work involves CMOS devices and process technologies. Later, he has had various technical and managerial positions in technology development and IC manufacturing. He was the Director of Technology Development at Cypress Semiconductor.

In 1992, He joined TSMC as the Senior Director responsible for Product Engineering and Backend Operations. He was later promoted to the V.P. of R&D, building technology base for TSMC, defining and driving technology roadmaps for the foundry industry. In 1997, he joined the start-up team as the V.P. of Operations for WaferTech, a JV then led by TSMC in Camas Washington. He built and ramped up the fab to 30 thousand wafers a month. During his last year in WaferTech, he became the V.P. of Business Development. In 2004, he joined NVIDIA as the V.P. of Technology and Foundry Operations.

Dr. Chen has published 100 papers, mostly by IEEE. His book on " CMOS Devices and Technology for VLSI ", was published by Prentice Hall in 1990. He was elected as an IEEE Fellow in 1992 for "leadership in and contributions to advanced CMOS device and process technology". He was a member of the Technical Advisory Committee for ITRI, Taiwan from 1988 to 1992. He now serves on the technical committees of SIA and GSA.

Dr. Chen was a Howard Hughes Doctor Fellow and received a Ph.D. in EE and an Executive Management degree, both from UCLA. He also holds a M.S. from University of Maine and a B.S. from National Taiwan University, both in E.E.

Lori Nye
VP Strategic Manufacturing and Alliances
Brewer Science

(Photo and Bio to come)

Janice M. Golda
Director Lithography Capital Equipment Development
Intel

Janice manages an organization responsible for creating strategies and working with Intel’s lithography, mask, and metrology suppliers and sub-suppliers to deliver equipment meeting Intel’s roadmap technology, capacity, and cost requirements. She has represented Intel on the SEMATECH Lithography Program Advisory Group, the US Lithography Technical Working Group, and the International EUV Symposium, and has presented and published for numerous industry forums. Janice is a member of the Berkeley CXRO Advisory committee and is Chairman of the Board for the EUV LLC. She holds one US patent. Janice joined Intel in 1989 and has held positions in lithography process engineering and program management. Janice earned a BS degree in Electrical Engineering from Cornell University.

Takeshi Hattori
President
Hattori Consulting International

Takeshi Hattori received the BS and MS degrees in electrical engineering from Sophia University, Tokyo, Japan in 1969 and 1971, respectively. He received the Degree of Engineer from Stanford university, Stanford, CA, in 1975, and the Ph.D. degree from Sophia university
in 1980.

In 1971, he joined Sony Corporation, where, at the Sony Research Center, Yokohama, Japan, he became involved in silicon-materials research, such as clean surface preparation, thermal oxidation of silicon in the presence of chlorine, and contamination/crystal-defect control and gettering in the fabrication of both MOS devices and CCD imagers. During 1973-1974, on leave of absence from Sony, he also worked on silicon device/process development at the Integrated Circuits Laboratory, Stanford University. Then he became Sony Corporate Chief Distinguished Engineer, involving in the research and development of next-generation MOS-LSI devices/processes as well as contamination-control and mini/agile-fab environment technologies at Sony Technology Center, Atsugi, Japan. As the head of the Ultra Clean Technology Research Laboratory there, he was also involved in the development of single-wafer spin cleaning and surface preparation technologies, non-aqueous and supercritical-fluid cleaning, and yield enhancement strategies, and their implementation in the firm’s semiconductor manufacturing fabs worldwide. He retired from Sony in 2007, and is currently with Hattori Consulting. His career spans more than 36 years experience in the semiconductor field.

He is the author of numerous technical papers and the editor and author of major chapters of Ultra Clean Surface Processing of Silicon Wafers Secrets of VLSI Manufacturing. In 2005, Dr. Hattori received the Werner Kern Award in recognition of his contribution to the development of innovative wafer cleaning and surface preparation technology. He is a Fellow of the Electrochemical Society.

Dr. Hattori served as the International Cooperation Committee chair and a member of the Board of Directors of the Ultra Clean Society (UCS), Tokyo, 1988-2000 until it closed the activity. He is Vice-Chair of the Executive Committee of the International Symposium on Semiconductor Manufacturing (ISSM) sponsored by SEMI and IEEE. He is a founding member of this symposium, and had served as its Program Committee chair 1992-2002. He is also a member of SEMI’s Japan Regional Standards Committee as well as SEMI/SEAJ Forum in Japan, the International Symposium on Semiconductor Devices and Materials (SSDM), the Electrochemical Society’s International Symposium on Cleaning Technology in Semiconductor Device manufacturing, among others.

Dr. Hans Stork
Chief Technology Officer and Group Vice President
Applied Materials, Inc.

Dr. Hans Stork was named chief technology officer and group vice president for the Silicon Systems Group at Applied Materials in October 2007, where he is responsible for leading the company’s roadmap for silicon technology equipment. In this role, Dr. Stork oversees integrated technology development across the silicon products, coordinates the organization’s industry and university engagements and ensures value to customers by leveraging understanding of technology interactions to optimize differentiated product solutions.

Prior to joining Applied Materials, Dr. Stork served as CTO and senior vice president of Silicon Technology Development for Texas Instruments from 2001 to 2007. He served as lab director for ULSI and Storage & Systems Labs for Hewlett Packard from 1994 to 2001, and was senior manager for Exploratory Si Technology at IBM from 1982 to 1994, where he received two outstanding achievement awards.

Dr. Stork is an IEEE Fellow and member of the board of directors for Semiconductor Research Corporation and the Semiconductor Industry Association technology strategy committee. He previously served as a member of the advisory committee for the Texas State Emerging Technology Fund from 2005 to 2006 and was a member of the board of directors for Sematech from 2002 to 2007.

Dr. Stork earned both a bachelor of science and Diplom-Ingenieur degree in electrical engineering from Delft University of Technology, The Netherlands. He earned his doctorate in electrical engineering from Stanford University.

Peter Singer.
Editor-in-Chief of Solid State Technology
PennWell Corporation

Peter Singer has been covering the semiconductor and related industries for more than 26 years. Now Editor-in-Chief of Small Times and Solid State Technology, he was previously with Semiconductor International. He has authored more than 200 articles on all aspects of semiconductor manufacturing and related industries, including optoelectronics, photonics and photovoltaics. He has a degree in electrical engineering from the University of Illinois, Champaign-Urbana.